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 CX2SM CRYSTAL
760 kHz to 1.35 MHz
Low Profile Miniature
TM
Surface Mount Quartz Crystal
DESCRIPTION actual size
The CX2SM quartz crystals are leadless devices designed for surface mounting on printed circuit boards or hybrid substrates. They are hermetically sealed in a rugged, miniature ceramic package. They are manufactured using the STATEK-developed photolithographic process, and were designed utilizing the experience acquired by producing millions of crystals for industrial, commercial, military and medical applications. Maximum process temperature should not exceed 260O C.
FEATURES
side view
Glass Lid Shown
PACKAGE DIMENSIONS B 1
Extensional mode Ideal for use with microprocessors Designed for low power applications Compatible with hybrid or PC board Low aging Full military testing available Ideal for battery operated applications Designed and manufactured in the USA
EQUIVALENT CIRCUIT C D E 3 F 2 I G H A
TYP. DIM A B inches 0.260 0.094 0.035 0.059 0.050 0.105 0.155 0.210 mm 6.60 2.39 0.89 1.50 1.27 2.67 3.94 5.33 inches 0.275 0.108 0.045 0.069 0.060 0.115 0.165 0.220
MAX. mm 6.99 2.74 1.14 1.75 1.52 2.92 4.19 5.59
C0 1 L1 C1 R1 2
C D E F G H I
see below
R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance
SUGGESTED LAND PATTERN
DIM "C"
0.105 (2.67)
GLASS LID inches 0.065 0.067 0.070 mm 1.65 1.70 1.78
CERAMIC LID inches 0.075 0.077 0.080 mm 1.91 1.96 2.03
MAX SM1 SM2 SM3
0.113 (2.87) 0.060 (1.52) inches (mm)
GRID COURTYARD
1 2
Note: Terminal 1 is electrically connected internally to terminal 3
0.060 (1.52)
10135 - Rev B
S
YS
TEM
CERTIFIC
AT
N IO
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com
IS O
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SPECIFICATIONS
TYPICAL APPLICATION FOR A PIERCE OSCILLATOR
Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Frequency Range 760 kHz - 1.35 MHz Functional Mode Extensional + _ 500 ppm (0.05%) Calibration Tolerance* + _ 1000 ppm (0.1%) + _ 10000 ppm (1.0%) Load Capacitance 7 pF Motional Resistance (R1) 5 k MAX Motional Capacitance (C1) 1.2fF Quality Factor (Q) 150 k Shunt Capacitance (C0) 1.0 pF Drive Level 3 W MAX Turning Point (T )** 35OC 0 Temperature Coefficient (k) -0.035 ppm/OC2 Aging, first year 5 ppm MAX Shock, survival 1000 g peak, 0.3 ms,1/2 sine Vibration, survival 10 g RMS, 20-1,000 Hz random Operating Temp. Range -10OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) Storage Temp. Range -55OC to +125OC Max Process Temperature 260OC for 20 sec. Note: Frequency f at temperature T is related to frequency f0 at turning point temperature T0 by: f-f0 2 = k(T-T0) f0
* Tighter frequency calibration available. ** Other turning points available.
The low profile CX miniature surface mount crystal is ideal for small, high density, battery operated portable products. The CX crystal designed in a Pierce oscillator (single inverter) circuit provides very low current consumption and high stability. A conventional CMOS Pierce oscillator circuit is shown below. The crystal is effectively inductive and in a PI-network circuit with CD and CG provides the additional phase shift necessary to sustain oscillation. The oscillation frequency (f0) is 15 to 150 ppm above the crystal's series resonant frequency (fS). Drive Level RA is used to limit the crystal's drive level by forming a voltage divider between RA and CD. RA also stabilizes the oscillator against changes in the amplifiers output resistance (R0). RA should be increased for higher voltage operation. Load Capacitance The CX crystal calibration tolerance is influenced by the effective circuit capacitances, specified as the load capacitance (CL). CL is approximately equal to: CL = CD x CG CD + CG
+ CS
(1)
NOTE: CD and CG include stray layout to ground and CS is the stray shunt capacitance between the crystal terminal. In practice, the effective value of CL will be less than that calculated from CD, CG and CS values because of the effect of the amplifier output resistance. CS should be minimized. The oscillation frequency (f0) is approximately equal to: f0 = fS 1 + Where f S C1 C0
[
C1 2(C0 + CL)
]
(2)
TERMINATIONS
Designation SM1 SM2 SM3
Termination Gold Plated Solder Plated Solder Dipped
= Series resonant frequency of the crystal = Motional Capacitance = Shunt Capacitance
CONVENTIONAL CMOS PIERCE OSCILLATOR CIRCUIT
PACKAGING OPTIONS
Rf BUFFER OSC Freq (fO )
CX2SM
- Tray Pack -16mm tape, 7" or 13" reels
(Reference tape and reel data sheet 10109)
HOW TO ORDER CX2SM CRYSTALS CX2 S C SM1 1.0M,
Frequency K = kHz M = MHz Calibration Tolerance @ 25OC (in ppm)
AMPLIFIER
M
RA
500
/
Blank = Glass Lid C = Ceramic Lid "S" if special or custom design. Blank if Std. SM1 = Gold Plated SM2 = Solder Plated SM3 = Solder Dipped
Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified
CG
CX2
CD
10135 - Rev B
S
YS
TEM
CERTIFIC
AT
N IO
STATEK CORPORATION 512 N. MAIN ST., ORANGE, CA 92868 714-639-7810 FAX: 714-997-1256 www.statek.com
IS O
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